From 5e67c9f2c7a5b517aef1fb2dd42cc65fc40836e3 Mon Sep 17 00:00:00 2001 From: Luke Kenneth Casson Leighton Date: Fri, 2 Aug 2019 08:34:01 +0100 Subject: [PATCH] clarify intro --- 3d_gpu.mdwn | 17 ++++++++++------- 1 file changed, 10 insertions(+), 7 deletions(-) diff --git a/3d_gpu.mdwn b/3d_gpu.mdwn index 42af75d88..6f51ab40c 100644 --- a/3d_gpu.mdwn +++ b/3d_gpu.mdwn @@ -7,17 +7,20 @@ Our primary goal is to design a **complete** all-in-one processor (System-on-a-Chip) that happens to include a libre-licensed VPU and GPU. We seek investors, sponsors, engineers and potential customers, who are -interested in the creation and use of an entirely libre low-power mobile -class system-on-a-chip. Comparative benchmark performance, pincount and -price is the Allwinner A64, except that the power budget target is 2.5 watts -in a 16x16mm 320 to 360 pin 0.8mm FBGA package. +interested, as a first product, in the creation and use of an entirely +libre low-power mobile class system-on-a-chip. Comparative benchmark +performance, pincount and price is the Allwinner A64, except that the +power budget target is 2.5 watts in a 16x16mm 320 to 360 pin 0.8mm +FBGA package. Instead of single-issue higher clock rate, the design is +multi-issue, aiming for around 800mhz. The lower pincount, lower power, and higher BGA pitch is all to reduce the cost of product development when it comes to PCB design and layout: -* Above 4 watts requires metal packages, thermal management and much - pricier PMICs. -* 0.6mm pitch BGA and below requires much more expensive PCBA techniques. +* Above 4 watts requires metal packages, greater attention to thermal + management in the PCB design and layout, and much pricier PMICs. +* 0.6mm pitch BGA and below requires much more expensive PCB manufacturing + equipment and more costly PCBA techniques. * Above 600 pins begins to reduce production yields as well as increase the cost of testing and packaging. -- 2.30.2