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[libreriscv.git] / shakti / m_class / pinmux.mdwn
1 # Pin Multiplexing
2
3 * <http://bugs.libre-riscv.org/show_bug.cgi?id=8>
4 * <https://github.com/sifive/sifive-blocks/tree/master/src/main/scala/devices/>
5 includes GPIO, SPI, UART, JTAG, I2C, PinCtrl, UART and PWM. Also included
6 is a Watchdog Timer and others.
7 * <https://github.com/sifive/freedom/blob/master/src/main/scala/everywhere/e300artydevkit/Platform.scala>
8 Pinmux ("IOF") for multiplexing several I/O functions onto a single pin
9
10 Surprisingly complex!
11
12 # Requirements
13
14 "to create a general-purpose libre-licensed pinmux
15 module that can be used with a wide range of interfaces that have
16 Open-Drain, Push-Push *and bi-directional* capabilities, as well as
17 optional pull-up and pull-down resistors, in an IDENTICAL fashion to
18 that of ALL major well-known embedded SoCs from ST Micro, Cypress,
19 Texas Instruments, NXP, Rockchip, Allwinner and many many others".
20
21 * Number of wires shall be minimised especially in cases where
22 the IO pad (puen, oe) need to change under the control of the
23 function (not the GPIO registers).
24 * There shall be no short-circuits created by multiple input
25 pins trying to drive the same input function
26 * The IO pad shall have pull-up enable, pull-down enable, variable
27 frequency de-bounce, tri-state capability, Open Drain and CMOS
28 Push-Push.
29 * The amount of latency (gates in between I/O pad and function)
30 shall be minimised
31
32 ## Analysis
33
34 Questions:
35
36 * Can damage occur (to the ASIC) by outputs being short-circuited to outputs
37 in any way?
38 A partial analysis showed that because outputs are one-to-many, there should
39 not be a possibility for that to occur. However what if a function is
40 bi-directional?
41 * Is de-bouncing always needed on every input? Is it ok for de-bouncing
42 to be only done on EINT?
43 * Can the input mux be turned round and "selector" logic added so that
44 there is no possibility of damage to inputs?
45
46 # Images
47
48 * [[mygpiomux.jpg]]
49
50 # GSoC2018
51
52 Introductions:
53
54 * Luke Kenneth Casson Leighton (lkcl) - reverse-engineer, software libre
55 advocate, assembly-level programming and disassembly, python, c, c++,
56 gate-level circuit and ASIC design, PCB design and assembly, 3D CAD design,
57 lots of different stuff. Guardian of the EOMA68 Certification Mark,
58 and currently responsible for coordinating the design of a fully Libre
59 RISC-V SoC in collaboration with the RISE Group, IIT Madras, Shakti Project.
60 not much experience at verilog (have done a couple of tutorials).
61 * Xing GUO(xing) - undergraduate (3rd year) from Southeast
62 University, EE student, C/C++, Python, Verilog, assembly (not very proficient),
63 Haskell (not very proficient). RTL design, server maintenance.
64 E-mail: higuoxing at gmail dot com, Github: [Higuoxing](https://github.com/higuoxing) some of my projects are there :)
65 * Aurojyoti Das(auro) - graduate student (MSc Electrical - Microelectronics)
66 at TU Delft, Netherlands. C/C++, Verilog, VHDL, SystemVerilog, RTL Design,
67 Logic Verification, Python/Perl/Shell scripting, Analog IC Design (currently learning)
68
69 Hardware available:
70
71 * lkcl: ZC706
72 * xing: zynq-7020 and Xilinx XC7A100T-484
73
74 # Discussion and Links
75
76 * <https://elinux.org/images/b/b6/Pin_Control_Subsystem_Overview.pdf>
77 * <https://lists.librecores.org/pipermail/discussion/2018-February/thread.html>
78 * <https://lists.librecores.org/pipermail/discussion/2018-January/000404.html>
79
80 ## Some Useful Resource
81
82 * <https://docs.scala-lang.org/tour/tour-of-scala.html> A brief Scala tutorial
83 * <https://github.com/ucb-bar/chisel-tutorial> A brief Chisel tutorial
84
85 # Pinouts Specification
86
87 Covered in [[pinouts]]. The general idea is to target several
88 distinct applications and, by trial-and-error, create a pinmux table that
89 successfully covers all the target scenarios by providing absolutely all
90 required functions for each and every target. A few general rules:
91
92 * Different functions (SPI, I2C) which overlap on the same pins on one
93 bank should also be duplicated on completely different banks, both from
94 each other and also the bank on which they overlap. With each bank having
95 separate Power Domains this strategy increases the chances of being able
96 to place low-power and high-power peripherals and sensors on separate
97 GPIO banks without needing external level-shifters.
98 * Functions which have optional bus-widths (eMMC: 1/2/4/8) may have more
99 functions overlapping them than would otherwise normally be considered.
100 * Then the same overlapped high-order bus pins can also be mapped onto
101 other pins. This particularly applies to the very large buses, such
102 as FlexBus (over 50 pins). However if the overlapped pins are on a
103 different bank it becomes necessary to have both banks run in the same
104 GPIO Power Domain.
105 * All functions should really be pin-muxed at least twice, preferably
106 three times. Four or more times on average makes it pointless to
107 even have four-way pinmuxing at all, so this should be avoided.
108 The only exceptions (functions which have not been pinmuxed multiple
109 times) are the RGB/TTL LCD channel, and both ULPI interfaces.
110
111 # GPIO Pinmux Power Domains
112
113 Of particular importance is the Power Domains for the GPIO. Realistically
114 it has to be flexible (simplest option: recommended to be between
115 1.8v and 3.3v) as the majority of low-cost mass-produced sensors and
116 peripherals on I2C, SPI, UART and SD/MMC are at or are compatible with
117 this voltage range. Long-tail (older / stable / low-cost / mass-produced)
118 peripherals in particular tend to be 3.3v, whereas newer ones with a
119 particular focus on Mobile tend to be 1.2v to 1.8v.
120
121 A large percentage of sensors and peripherals have separate IO voltage
122 domains from their main supply voltage: a good example is the SN75LVDS83b
123 which has one power domain for the RGB/TTL I/O, one for the LVDS output,
124 and one for the internal logic controller (typical deployments tend not
125 to notice the different power-domain capability, as they usually supply all
126 three voltages at 3.3v).
127
128 Relying on this capability, however, by selecting a fixed voltage for
129 the entire SoC's GPIO domain, is simply not a good idea: all sensors
130 and peripherals which do not have a variable (VREF) capability for the
131 logic side, or coincidentally are not at the exact same fixed voltage,
132 will simply not be compatible if they are high-speed CMOS-level push-push
133 driven. Open-Drain on the other hand can be handled with a MOSFET for
134 two-way or even a diode for one-way depending on the levels, but this means
135 significant numbers of external components if the number of lines is large.
136
137 So, selecting a fixed voltage (such as 1.8v or 3.3v) results in a bit of a
138 problem: external level-shifting is required on pretty much absolutely every
139 single pin, particularly the high-speed (CMOS) push-push I/O. An example: the
140 DM9000 is best run at 3.3v. A fixed 1.8v FlexBus would
141 require a whopping 18 pins (possibly even 24 for a 16-bit-wide bus)
142 worth of level-shifting, which is not just costly
143 but also a huge amount of PCB space: bear in mind that for level-shifting, an
144 IC with **double** the number of pins being level-shifted is required.
145
146 Given that level-shifting is an unavoidable necessity, and external
147 level-shifting has such high cost(s), the workable solution is to
148 actually include GPIO-group level-shifting actually on the SoC die,
149 after the pin-muxer at the front-end (on the I/O pads of the die),
150 on a per-bank basis. This is an extremely common technique that is
151 deployed across a very wide range of mass-volume SoCs.
152
153 One very useful side-effect for example of a variable Power Domain voltage
154 on a GPIO bank containing SD/MMC functionality is to be able to change the
155 bank's voltage from 3.3v to 1.8v, to match an SD Card's capabilities, as
156 permitted under the SD/MMC Specification. The alternative is to be forced to
157 deploy an external level-shifter IC (if PCB space and BOM target allows) or to
158 fix the voltage at 3.3v and thus lose access to the low-power and higher-speed
159 capabilities of modern SD Cards.
160
161 In summary: putting level shifters right at the I/O pads of the SoC, after
162 the pin-mux (so that the core logic remains at the core voltage) is a
163 cost-effective solution that can have additional unintended side-benefits
164 and cost savings beyond simply saving on external level-shifting components
165 and board space.
166